The KeyW Engineering Development and Special Projects Division (EDSP) develops hardware solutions and products for the Intelligence Community and DoD missions. This includes hardware products related to the Signals Intelligence (SIGINT) mission, Tagging, Tracking, & Locating (TTL) mission, special communications technologies such as software defined radios (SDRs), and Electronics Packaging.

The field of Electronic Packaging is best defined as mechanical engineering of electronic systems. It involves the mechanical design of electronics through 4 levels including die, component, board, and chassis/cable. Within the design discipline, a mechanical engineer will use knowledge in heat transfer, structural mechanics, materials properties, general engineering design principles, geometric tolerance methods, and mechanically and electrically driven failure mechanisms. Many electronics must operate in extreme conditions such as in airplanes, satellites, ships, oil well drilling systems, and automobile engine compartments where they are exposed to extreme temperatures, thermal shock, vibration, structural shock, moisture, corrosion, and other environmental conditions. Thermal analysis techniques such as 1D thermal resistance modeling, finite difference method, or finite element methods are used to build models that analyze and optimize heat dissipation. Vibration and structural shock analysis is performed utilizing finite element software to calculate structural magnification factors and derive internal stresses to determine if the devices will survive the operating environment and the device lifetime. In selection of materials, it is important to consider material compatibility, weight, thermal performance, strength, cost, and any special processes required to manufacture or assemble.

Responsibilities

All activities will be designed to give the intern a full understanding of the engineering design lifecycle and insight into the role that Mechanical Engineers play at KeyW. To facilitate their education and the quality of their experience each intern will be paired one-on-one with a mentor of the same discipline.

Responsibilities:

Intern will support electronics packaging design and manufacturing activities. Tasking may include:

• 3D CAD design and drafting of mechanical/electrical components and assemblies
• Performing engineering analyses: thermal, structural, tolerance stack-ups
• Fabricating, assembling and qualifying 1st article engineering prototypes
• Designing and conducting laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes
• Performing vendor research, selection and interface

Qualifications

Skills and Qualifications:

Required Availability: 2-3 Months

Required Qualifications:

• Pursing a Bachelors (3rd year or above) or Masters degree in one of the following disciplines: Mechanical Engineering, Manufacturing Engineering, Materials Science Engineering
• Cumulative GPA

3.0/4.0

Desired Skills:

• Experience in designing and carrying out experiments (e.g. undergraduate/graduate research, lab coursework)
• Machine design and drafting experience
• 3D Computer-Aided-Design (CAD) experience (i.e. Solidworks)
• Hands-on manufacturing experience (e.g. machining, soldering, etcli>
• Good writing, communication, and interpersonal skills

Location: Severn, MD

Clearance: Must be able to obtain and maintain a security clearance

KeyW is an EEO employer. We are committed to providing fair and equal employment consideration, regardless of race, color, religion, national origin, gender, sexual orientation, age, marital status or disability.

About the Organization

KeyW is a pure-play national security solutions provider for the Intelligence, Cyber and Counterterrorism Communities' toughest challenges. We support the collection, processing, analysis and dissemination of information across the full spectrum of their missions. We employ and challenge more than 2,000 of the most talented professionals in the industry with solving such complex problems as preventing cyber threats, transforming data into intelligence and combating global terrorism.